➥ Maintain a well-structured schematic symbol and PCB footprint library fully aligned with IPC standards, ensuring consistency, accuracy, traceability, and long-term reusability across projects.
➥ Design complex multi-layer PCBs for high-power motor controllers, DC-DC converters, inverters, battery management systems (BMS), RF modules, antenna layouts, and high-speed digital interfaces operating in the GHz range.
➥ Possess strong expertise in defining reliable, manufacturable PCB stack-ups, including rigid, flexible, and rigid-flex designs, ensuring optimal electrical performance, mechanical reliability, thermal stability, and cost efficiency.
➥ Optimize power planes, creepage and clearance distances, isolation barriers, and thermal dissipation paths for high-voltage and high-current designs, ensuring safety, performance, and compliance.
➥ Implement low-inductance routing, controlled impedance structures, and robust grounding schemes for high-power and high-speed circuits. Optimize layouts to minimize crosstalk, reflections, EMI, and insertion loss.
➥ Select appropriate PCB substrate materials such as FR4, Rogers, Polyimide, and high-Tg laminates based on performance, reliability, frequency, and environmental requirements. Implement microstrip, stripline, coplanar waveguide, and controlled impedance routing techniques.
➥ Apply EMI/EMC best practices, including shielding strategies, filtering networks, differential pair routing, star grounding, guard rings, Kelvin sensing, and noise isolation methods to achieve low-noise, high-integrity designs.
➥ Ensure compliance with IPC standards (IPC-2221, IPC-600, IPC-6012), EMI/EMC regulations, and applicable automotive, industrial, and safety certification requirements.
➥ Collaborate closely with RF engineers to optimize antenna layouts, RF routing, grounding strategies, and impedance matching, enhancing overall signal integrity and RF performance.
➥ Design low-noise precision analog layouts, including op-amp circuits, ADCs, DACs, sensor interfaces, and mixed-signal designs, ensuring minimized parasitic capacitance, inductance, and noise coupling.
➥ Work closely with mechanical engineers to optimize PCB form factor, enclosure integration, airflow, and cooling solutions, implementing thermal vias, heat sinks, copper pours, metal-core PCBs (MCPCB), and heat-spreading techniques for high-power designs.
➥ Demonstrate strong expertise in component footprint validation, 3D mechanical verification, and full PCB layout documentation prior to Gerber release.
➥ Generate manufacturing-ready Gerber RS-274X outputs, separate Excellon drill files for PTH and NPTH, detailed stack-up drawings, and complete fabrication notes covering materials, finishes, tolerances, impedance requirements, and special manufacturing instructions.
➥ Collaborate with PCB fabrication and assembly partners to ensure high-yield manufacturing, first-pass success, and production scalability.
